Introductory
11/31
CVD (Chemical vapor deposition) ­ Characteristics
·Vapor or liquid material source,
·Besides sample, no solid material is related to reaction.
·Chemical reaction on specific surface,
·Owing to chemical reaction, only those areas exposed
(functional areas) will have thin film deposited.
·A kind of self-alignment process.
·Better step coverage and gap fill capability,
·Chemical gas or vapor react with sample surface thus
step coverage is good.
·Less physical damage of sample,
·No physical bombardment onto sample surface.

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