Introductory
12/31
CVD (Chemical vapor deposition) ­ Pros
·Self-alignment process,
·If a specific area is well-defined, only the selected area
will be coated with thin film.
·No photolithography is needed.
·Variation of equipment layout,
·Owing to gas and vapor reaction, inlet and sample
locations can be adjusted for better uniformity.
·Low damage on sample and waste of target,
·Without high energy plasma bombardment, sample
surface can be preserved and no waste for target
material.

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