Introductory
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PVD (Physical vapor deposition) ­ Cons
·Straightforward (downward/upward) deposition,
·Not capable for undercut or high aspect ratio
structures.
·Film thickness uniformity issue,
·Owing to sample size, target size, and system layout,
film thickness may be different.
·Gas mixture issue,
·Owing to system layout, gas mixture inside the
chamber may be uneven.
·Gas and vacuum selection,
·High vacuum (<10-5Torr) is usually required for light-
weight atoms.

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