Cheng-Hsien Liu, Ph.D.

      Professor of Power Mechanical Engineering Department

Professor of Institute of NanoEngineering and MicroSystems

      Supervisor of Micro-Systems and Control Laboratory

      National Tsing Hua University

 

Mailing Address: Engineering Building #1, Room 517
      National Tsing Hua University
      Hsinchu, Taiwan 30013, R.O.C.

E-mail: liuch@pme.nthu.edu.tw
Phone: (886-3)-5742496
Fax: (886-3)-572-2840

 


International Scientific and Professional Activities

 

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Professional Affiliation:

 

 ASME Member (American Society of Mechanical Engineers)

 

 IEEE Member

 

 SPIE member (The International Society for Optical Engineering)

 

* ACS member (American Chemical Society)

 

* OSA member (Optical Society of America)

 

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Program committee member for international conferences: (selected)

 

* Area 7 Vice Chair (Area 7: Organic / Molecular / Bio-electronics) & Technical Program Committee: 2019 International Conference on Solid State Devices and Materials, Nagoya University, Japan (SDM2019)

 

* Symposium Chair: Advances in Experimental Solid Mechanics at 2019 International Conference on Computational & Experimental Engineering and Sciences (ICCES'19, Tokyo, Japan), March 25~28, 2019.

 

* Technical Program Committee: The 14th Annual IEEE International Conference on Nano/Micro Engineering and Molecular Systems (2019 IEEE NEMS)

 

* * Technical Program Committee: 2018 International Conference on Solid State Devices and Materials, Tokyo, Japan (SDM2018)

 

* Technical Program Committee: 2018 IEEE International Conference on Nano/Micro Engineering and Molecular Systems (2018 IEEE NEMS)

 

* Area 11 Vice Chair (Area 11: Sensors and Materials for Biology, Chemistry and Medicine) & Technical Program Committee: 2017 International Conference on Solid State Devices and Materials, Japan (SDM2017)

 

* Session Chair: The 19th International Conference on Solid-State Sensors, Actuators and Microsystems, (Transducer 2017)

 

* Technical Program Committee: 2017 IEEE International Conference on Nano/Micro Engineering and Molecular Systems, Los Angeles, CA, USA (2017 IEEE NEMS)

 

* Technical Program Committee: 2016 International Conference on Solid State Devices and Materials, Japan (SDM2016)

 

* Organizing committee of Experimental Methods in Engineering, International Conference on Computational & Experimental Engineering and Sciences (ICCES'16), Madeira, Portugal, September 5 - 9, 2016

 

* Technical Program Committee: The 6th International Multidisciplinary Conference on Optofluidics, Beijing, China 2016

 

* 2015 International Conference on Solid State Devices and Materials (SDM2015) (TPC)

 

* 2015 Optofluidics International Conference (TPC and Award Committee Chair)

 

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Journal paper review for: (selected)

 

 Acta Biomaterialia

 

* RSC Advances

 

 Analyst

 

 Automatica

 

 ASME Journal of Electronic Packaging

 

 Biofabrication

 

 Biotechnology

 

* Biotechnology Progress

 

* Chemical Communications

 

* Chemical Society Reviews

 

* Experimental Thermal and Fluid Science Journal

 

* IFAC (International Federation of Automatic Control) Control Engineering Practice

 

* IEEE Instrumentation and Measurement Society

 

 IEEE Transactions on Instrumentation and Measurement

 

 IEEE/OSA Journal of Lightwave Technology

 

 IEEE/ASME Journal of MicroElectroMechanical Systems

 

 IEEE/ASME Trans on Mechatronics

 

* IEEE Sensors Journal

 

* Journal of Dynamic Systems, Measurement and Control

 

* Journal of Industrial and Engineering Chemistry

 

* Journal of Laboratory Automation

 

* Journal of Lightwave Technology

 

 Langmuir

 

 Lab on a chip

 

* Microfluidics and Nanofluidics

 

 Nanotechnology

 

* Nature Protocols

 

* Optics Communications

 

 Physical Chemistry Chemical Physics

 

* Review of Scientific Instruments

 

 Royal Society of Chemistry (RSC) Journal: The Analyst- Communication

 

 Sensors and Actuators A-Physical

 

 Sensors and Actuators B-Chemical

 

* Scientific Instruments

 

 Sensors

 

 Book proposal review for Cambridge University Press


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Last update: Jan. 14, 2019 by Cheng-Hsien Liu