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| Chang-Chun Lee |
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| Telephone No: +886-(03)-5162410 |
| Email: cclee@pme.nthu.edu.tw |
| Office: Room 519,
Engineering
Building I |
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| 09/2002 ~ 06/2006, Ph.D., Power Mechanical Engineering, National Tsing Hua University (NTHU), Taiwan. |
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| 09/2000 ~ 06/2002, M.S., Power Mechanical Engineering, National Tsing Hua University, (NTHU), Taiwan. |
| 09/1996 ~ 06/2000, B.S., Mechanical Engineering, Chung Yuan Christian University (CYCU), Taiwan. |
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Mechanical Designs
and Integrations of 3D IC System, Back-End of Line
(BEOL) Process Enhancement and Reliability
Investigation of Nano-Micro Devices, Strain Silicon
Engineering, Advanced Microsystem Packaging,
Computational Solid Mechanics, Thin Film Mechanics,
Coupled-Field Nonlinear Finite Element Analysis. |
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| 2007 Jan.~ 2011 Jan. |
R&D principal engineer, tsmc
(Taiwan Semiconductor Manufacturing Company, TW) |
| 2011 Feb.~ 2014 Jul. |
Assistant Professor, Department of Mechanical Engineering, Chung Yuan Christian University (CYCU) |
| 2012 Feb.~ 2016 Jan. |
Adjunct Assistant Professor, Department of Power Mechanical Engineering, National Tsing Hua University (NTHU) |
| 2014 Aug.~ 2016 Jul. |
Associate Professor, Department of Mechanical Engineering, Chung Yuan Christian University (CYCU) |
| 2016
Feb.~ 2017 Jul. |
Adjunct
Associate Professor, Department of Power Mechanical Engineering, National Tsing Hua University (NTHU) |
| 2016 Aug.~ 2017 Jul. |
Associate
Professor, Department of Mechanical
Engineering, National Chung Hsing University
(NCHU) |
| 2017
Aug.~ 2019 Jul. |
Associate Professor, Department of Power
Mechanical Engineering, National Tsing Hua
University (NTHU) |
| 2019 Nov.~2022 Oct. |
Associate
Head, Department of Power Mechanical
Engineering, National Tsing Hua University
(NTHU) |
| 2019 Aug.~ Present |
Professor, Department of Power
Mechanical Engineering, National Tsing Hua
University (NTHU) |
| 2017 Aug.~ Present |
Vice Director of Advanced Packaging Research
Center, National Tsing Hua University |
| 2022
Feb.~ Present |
CEO, Tze Chiang Foundation of Science and
Technology |
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Received “IEEE T-CPMT Best Associate Editor
Award”, 2024. |
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Received “Service Award” from
Society of Theoretical and Applied Mechanics (STAM)
of the Republic of China, 2023. |
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Appointed as a
Distinguished Researcher by the Industrial
Technology Research Institute (ITRI), 2023. |
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Received “Outstanding
Research Award” from National Science and
Technology Council (NSTC), 2023. |
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Received
“Outstanding Youth Award” from Taiwan
Association for Coating and Thin Film Technology
(TACT), 2021. |
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Received
“Outstanding Alumni” from Department of
Mechanical Engineering, Chung Yuan Christian
University (CYCU), 2020. |
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Received
“Outstanding Young Investigator Award” from
National Tsing Hua University
(NTHU), 2018. |
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Received
“Outstanding Young Investigator Award” from
Engineering College of National Tsing Hua University
(NTHU), 2018. |
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Received
“Outstanding Young Engineering Professor Award”
from The Chinese Society of Mechanical
Engineers (CSME), 2016. |
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Received “Distinguished
Young Scholar Award” from Society of
Theoretical and Applied Mechanics (STAM) of the
Republic of China, 2016. |
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Received “Ta-You Wu Memorial Award” from National Science Council, 2013. |
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Received
“Outstanding Research Award” from Chung
Yuan Christian University (CYCU), 2014. |
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Received “Young Scholar Award of Chung Yuan Christian University (CYCU),” 2012, 2013,
2014. |
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Received a Prize of “Project for Excellent Junior Research Investigators” from
Ministry of Science and Technology (MOST), 2013
& 2016. |
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IEEE (Institute of Electrical
and Electronics Engineers) Senior Member |
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Received “Outstanding
Young Scholar Award” of International
Conference on Advanced Manufacturing (ICAM 2014),
2014. |
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Received “Bronze Medal
Award” from Taipei International Invention
Show & Technomart, 2015, 2016. |
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Received “Excellent
Prize of Industry-University Cooperation”
from College of Engineering of National Chung Hsing
University (NCHU), 2018. |
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Received “Award for
Excellent Instructional Assessment of Course”
from Chung Yuan Christian University
(CYCU), 2016. |
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Received “Good
Performance Award for University and Industry
Liaison System” from Chung Yuan Christian
University (CYCU), 2015-2016. |
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Selected as “Excellent
English Instructor” from Chung Yuan
Christian University (CYCU), 2015. |
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Received “Second Place” of
Student Essay Contest from Society of Theoretical
and Applied Mechanics of the Republic of China
(STAM), 2023. (Adviser) |
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Yu-Ru Liu Received the research
project of undergraduates from National Science and
Technology Council (NSTC), 2023. (Adviser) |
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Received “Oral Presentation
Group-Honorable Mention” of Student Essay Contest
from Engineering College of National Tsing Hua
University (NTHU), 2023. (Adviser) |
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Received “Honorable Mention” of
Student Essay Contest from Society of Theoretical
and Applied Mechanics of the Republic of China
(STAM), 2021. (Adviser) |
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Received “Oral Presentation
Group-Honorable Mention” of Student Essay Contest
from Engineering College of National Tsing Hua
University (NTHU), 2021. (Adviser) |
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Received “Poster Display
Group-Honorable Mention” of Student Essay Contest
from Engineering College of National Tsing Hua
University (NTHU), 2021. (Adviser) |
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Received “Bronze Award” of
Research Paper Award in Precision Engineering Topics
and Paper Awards of Taiwan Society for Precision
Engineering & Chroma ATE Inc., 2020.
(Adviser) |
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Received “Honorable Mention” of
Student Essay Contest from Society of Theoretical
and Applied Mechanics of the Republic of China
(STAM), 2020. (Adviser) |
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Received “Honorable Mention” of
2020 Master’s Degree Thesis Award from Chinese
Society Mechanical Engineering (CSME), 2020.
(Adviser) |
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Received “Honorable Mention” of
Student Essay Contest from Proceedings of the 37th
National Conference on Mechanical Engineering
(CSME), 2020. (Adviser) |
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Received “2017 College Student
Research Award” for the research project of
undergraduates from Ministry of Science and
Technology (MOST), 2018. (Adviser) |
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Received “Masterpiece Award”
from 2016 Engineering Paper Competition of Student
Chapter (Mechanical Group) from Chinese Institute of
Engineers (CIE), 2016. (Adviser) |
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Received Poster Merit Awards of
TACT2015, 2015. |
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Received IEEE IMPACT 2015
Student Paper Award, 2015. (Adviser) |
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Received “Masterpiece Award”from
2015 Project Competition of Semiconductor and
Optoelectronics Process Equipment/Critical Part,
2015. (Adviser) |
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Received IEEE IMPACT-EMAP 2014
Outstanding Paper Award, 2014. |
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Received ThinFilms2014 Poster
Competition Second Prize, 2014. |
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Session Chair
of International Conference on Electronics Materials
and Packaging - IEEE International Microsystem,
Packaging, Assembly and Circuits Technology
Conference (IMPACT-EMAP 2020 Conference). |
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Session Chair
of the ASME International Mechanical Engineering
Congress and Exposition (ASME IMECE 2020). |
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Session Chair
of ASME 2020 InterPACK Conference & Exhibition. |
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Session Co-Chair
of the 70th
IEEE Electronic Components Technology Conference
(ECTC 2020 Virtual Conference). |
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Session Chair of the 7th
Asian Pacific Congress on Computational Mechanics
(APCOM 2019). |
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Session Chair
of the Sixth Asian Conference on Mechanics of
Functional Materials and Structures (ACMFMS 2018). |
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Session Chair
of 2016 International Electron Devices and Materials
Symposium (IEDMS 2016). |
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Session Chair
of IMAPS All Asia Conference - IEEE International
Microsystem, Packaging, Assembly and Circuits
Technology Conference (IMPACT-IAAC 2016 Joint
Conference). |
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Session Chair
of IEEE International Microsystem, Packaging,
Assembly and Circuits Technology Conference (IMPACT
2015, IMPACT 2017, IMPACT 2021, IMPACT 2022, IMPACT
2023). |
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Session Chair
of International Conference on Electronics Materials
and Packaging - IEEE International Microsystem,
Packaging, Assembly and Circuits Technology
Conference (IMPACT-EMAP 2014 Conference). |
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Received “Golden Award of
digitized course of Chung Yuan Christian University
(CYCU),” 2013-2015. |
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Session Co-Chair of IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2014) |
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Session Chair of proceedings of the National Conference on Mechanical Engineering (2012, 2013,
2016, 2018) |
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Session Chair
of the Proceedings on Theoretical and Applied
Mechanics (CTAM 2013, CTAM 2016) (2013, 2016) |
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Session Co-Chair of IMAPS All Asia Conference - IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2013 Joint Conference). |
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Session Chair of Symposium in Honour of Prof. Wen-Hwa Chen (Multiphysics) in 2013 International Conference on Computational & Experimental Engineering and Sciences (ICCES'13). |
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Session Co-Chair of IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT 2012). |
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Invited expert for “The forum of standard technology in nano thin films,”the present topic is “mechanical properties measurements of nano thin films.” (刊登於經濟日報101/10/04 之A24版) |
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Journal paper“Development of Robust Flexible OLED Encapsulations Using Simulated Estimations and Experimental Validations,”is selected as the front cover of Journal of Physics D: Applied Physics (Jul. 2012). |
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Honorary Member of the Phi Tau Phi Scholastic Honor Society, R. O. C. |
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Best Paper Award (2005)-ANSYS Conference. |
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Graduation with High Honors, total GPA ranks 1st (out of 108 students) in the Mechanical Engineering department, Top 1%, recipient of 6 Scholarships from Chung Yuan Christian University. |
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Invited talk: “The
Estimated Importance of Virtual Prototyping
Simulation for Advanced Package,” College of
Mechanical and Electrical Engineering, National
Taipei University of Technology, Taipei, Taiwan,
03/21/2024. |
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Invited talk:
“Heterogeneous Integration Packaging,” Society of
Manufacturing Engineers, Taipei Chapter, Taipei,
Taiwan, 03/16/2024. |
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Invited talk:
“Heterogeneous Integration Packaging,” Department of
Mechatronics Engineering, National Kaohsiung
University of Science and Technology, Kaohsiung,
Taiwan, 11/22/2023. |
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Invitation
speaker of 2023 IEEE International
Microsystem, Packaging, Assembly and Circuits
Technology Conference (IMPACT 2023),“Warpage
Estimation and Demonstration of Panel-level Fan-out
Packaging with Cu Pillars Applied on a Highly
Integrated Architecture,” Taipei, Taiwan, Oct.
25-27, 2023. |
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Invited talk:
“Reliability Simulation and Prediction of
Microelectronic Packaging,” Tong Hsing Electronic
Industries, Ltd., Longtan, Taiwan, 03/07/2023. |
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Invitation
speaker of 2022 Taiwan Association for
Coating and Thin Film Technology (TACT
2022),“Simulation Prediction and Experimental
Demonstration of Process-Induced Warpage for
RDL-First Fan-Out Panel-Level Packaging,” Nantou,
Taiwan, Nov. 04-05, 2022. |
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Invited talk: “Mechanical
Reliability of Heterogeneous Integration Packaging,”
Graduate School of Advanced Technology (GSAT),
National Taiwan University, Taipei, Taiwan,
10/03/2022. |
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Invited talk:
“Application of Mechanical Calculation in Advanced
Semiconductor Packaging,” Department of Mechanical
Engineering, National Chung Cheng University,
Chiayi, Taiwan, 09/28/2022. |
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Invitation
speaker of the 2nd Symposium on Nano-Device
Circuits and Technology (SNDCT 2022),
“Simulation-based Methodology Utilized in
Panel-level/Wafer-level and Heterogeneous
Integration Packaging,” Hsinchu, Taiwan, May 19-20,
2022. |
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Invitation speaker
of 2022 International Conference on
Electronics Packaging (ICEP 2022),“Simulation
Prediction and Experimental Demonstration of
Process-Induced Warpage for RDL-First Fan-Out
Panel-Level Packaging,” Sapporo, Japan, May 11-14,
2022. |
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Invited talk:
“Heterogeneous Integration Packaging,” Department of
Materials Science and Engineering, National United
University, Miaoli, Taiwan, 04/06/2022. |
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Invited talk:
“Modelling Comparison of Equivalent Material
Approaches Utilized in Reliability Estimation of
Fan-Out Panel-Level Packaging,” Department of Civil
Engineering, National Chiao Tung University,
Hsinchu, Taiwan, 11/11/2020. |
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Invited talk:
“Application of Mechanical Simulation Analysis in
Advanced Soft Electronics,” Department of Mechanical
Engineering, Chung Yuan Christian University,
Chungli, Taiwan, 10/07/2020. |
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Invited talk:
“Modelling Comparison of Equivalent Material
Approaches Utilized in Reliability Estimation of
Fan-Out Panel-Level Packaging,” Department of
Materials Science and Engineering, National Tsing
Hua University, Hsinchu, Taiwan, 04/09/2020. |
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Invited talk: “Modeling for
Heterogeneous Integration Packaging - From Wafer to
Board Level,” Department of Mechanical Engineering,
National Taiwan University of Science and
Technology, Taipei, Taiwan, 03/20/2020. |
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Invited talk:
“Thermo-Mechanics, Multi-Physics, Thermal and
Reliability in Microelectronic and Microsystem
Packaging,” TXC Corporation, ChungLi, Taiwan,
01/06/2020. |
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Invitation speaker
of The Forum of Advanced Fabricated Process
Applications in Proceedings of the 43th
Conference on Theoretical and Applied
Mechanics,“Comprehensive Failure Mode Evaluation of
RDL within Flexible Electronic Packaging Structure
under Mechanical Loading,” Taichung, Taiwan, Nov.
29, 2019. |
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Invited talk:
“Mechanical Reliability Analysis of Advanced Soft
Electronics,” Department of Power Mechanical
Engineering, National Formosa University, Huwei,
Taiwan, 10/16/2019. |
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Semi-Plenary
Speaker, “Applications of Computational
Mechanics on Advanced Film-Type Nano/Micro
Structures,” 2019 International Conference on
Computational & Experimental Engineering and
Sciences (ICCES2019), Tokyo, Japan, March 25-28,
2019. |
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Invited talk: “The
Critical Issues of Advanced Soft Electronics,”
Department of Mechatronics Engineering, National
Changhua University of Education, Changhua, Taiwan,
11/29/2018. |
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Invited Lecture, “Elastic
Modulus Extraction of Single-Crystal Copper by Using
Spring-based Finite Element Method,” The 2nd
International Conference on Mechanics (ICM 2018),
Yilan, Taiwan, October 15-18, 2018. |
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Invited talk:
“Overview the Simulation Methodologies Applied for
Advanced Packages,” Department of Mechanical
Engineering, National Kaohsiung University of
Science and Technology, Kaohsiung, Taiwan,
10/12/2018. |
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Invited talk:
“Mechanical Simulation and Design Analysis of
Flexible Electronics,” Department of Mechanical
Engineering, Chung Yuan Christian University,
Chungli, Taiwan, 03/07/2018. |
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Invited talk:
“Mechanical Analysis and Simulated Techniques of
Flexible Display Devices,” Department of Power
Mechanical Engineering, National Tsing Hua
University, Hsinchu, Taiwan, 10/19/2017. |
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Invited talk: “The
Estimated Importance of Virtual Prototyping
Simulation for Advanced Package,” Institute of
NanoEngineering and MicroSystems, National Tsing Hua
University, Hsinchu, Taiwan, 10/02/2017. |
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Invited talk:
“Impacts of Thermo-Mechanical Stress on Interfacial
Cracking Behavior in Advanced Electronic Packaging,”
College of Engineering Seminar of National Tsing Hua
University, Hsinchu, Taiwan, 09/26/2017. |
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Invitation speaker
of the 2017 workshop of Semiconductor Precision
Manufacturing and Measurement Techniques,
“Pre-Bending Substrate and Related Stress Estimation
Techniques Applied for Advanced Packaging,” Hsinchu,
Taiwan, Sep. 22, 2017. |
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Invitation speaker
of the Prospect and Forum of Mechanical Simulations
for Soft Displays, “Process-Oriented Mechanical
Simulation Technology of Flexible Displays,”
Hsinchu, Taiwan, Jun. 08, 2016. |
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Invitation speaker
of the Proceeding of Nano-Mechanical Properties and
Applied Technologies of Semiconductors,
“Measurements and Estimations of Thin Film
Mechanical Properties and Adhesions for the
Influence on Nano/Micro Device Reliability,”
Hsinchu, Taiwan, Sep. 08, 2015. |
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Invitation speaker of the
Prospect and Forum of Advanced Display Technology,
“Influence and Estimation of Stress Induced from
Process and Loads on Advanced Display Technology,”
Hsinchu, Taiwan, Jun. 25, 2015. |
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Invited talk:
“Three-Dimensional Integrated Circuit (3D-ICs)
Technology,” Department of Refrigeration, Air
Conditioning and Energy Engineering, National
Chin-Yi University of Technology, Taichung, Taiwan,
10/08/2014. |
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Invitation speaker
of the Proceeding of Investigation and Applications
for Advanced Measurement Techniques of
Nano-Mechanical Properties, “Experimental
Measurements and Energy Estimation of Interfacial
Fracture in Stacked Thin Films of 3D ICs System,” Taipei, Taiwan, Sep. 11,
2014. |
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Invited talk: “Developments of Advanced Electronic Devices and Its Reliability Issues and Challenges,” Department of Mechanical Engineering, Chung Yuan Christian University, Chungli, Taiwan, 05/14/2014. |
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Invited talk: “Integration of Advanced 3D-ICs Packaging & Strained Silicon Technology,” Department of Mechanical & Mechatronic Engineering, National Taiwan Ocean University, Keelung, Taiwan, 12/09/2013. |
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Invitation speaker of the Proceeding of Measurement Technique and Application of Nano Scale Mechanical
Properties, “Effects of Thin Film Mechancial Properties Measurement on Micro-system Packaging Technologies,” Taoyuan, Taiwan, Nov. 04, 2013. |
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Invited talk: “Developments of Advanced Electronic Devices and Its Reliability Issues and Challenges,” Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung, Taiwan, 10/18/2013. |
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Invited talk: “Developments of Advanced Electronic Devices and Its Reliability Issues and Challenges,” Institute of Precision Engineering (IPE), National Chung Hsing University, Taichung, Taiwan, 04/12/2013. |
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Invited talk: “Developments of Advanced Electronic Devices and Its Reliability Issues and Challenges,” Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan, 11/19/2012. |
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Invitation speaker of The Forum of Advanced Fabricated Process Applications in Proceedings of the 36th Conference on Theoretical and Applied Mechanics,“Influences of Critical Designed Factors on Mechanical Reliability of Flexible OLED Package,” ChungLi, Taiwan, Nov. 16, 2012. |
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Invited talk: “High-Performance Computing Simulation for Analysis of Nano/Micro Electronic Structures,” Institute of Mechanical and Electro-Mechanical Engineering, National Formosa University, Huwei, Taiwan, 10/17/2012. |
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Invitation speaker, “Investigation of Thermal Stress on Interfacial Cracking Behavior in Advanced Electronic Packaging,”11th International Symposium on Microelectronics and Packaging (ISMP 2012), Seoul, Korea, October 10-11, 2012. |
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Invited talk: “Mechanical Design and Analysis of Nano/Micro Electronic Devices,” Department of Mechanical & Mechatronic Engineering, National Taiwan Ocean University, Keelung, Taiwan, 04/16/2012. |
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Invited talk: “Mechanical Design and Analysis of Nano/Micro Electronic Devices,” Department of Mechanical Engineering, National Taipei University of Technology, Taipei, Taiwan, 10/26/2011. |
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Invited talk: “The Application of Finite Element Simulation to Nano/Micro Electronic Devices,” Institute of Electro-Optical Science and Technology, National Taiwan Normal University, Taipei, Taiwan, 03/19/2009. |
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Guest Editor of
Materials (SCI/EI) for the Special Issue of
“Reliability Evaluation, Simulation and Mechanical
Analysis of Materials for Advanced Electronic
Package” |
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Lead Guest
Editor of Microelectronics Reliability (SCI/EI)
for the Special Issue of “Development and
Characteristics Assessment of Reliability for
Heterogeneous Integration Applications” |
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Associate Editor of
IEEE Transactions on Components, Packaging and
Manufacturing Technology (SCI/EI) |
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Associate Editor
of Microelectronic Reliability (SCI/EI) |
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Associate Editor of Journal of Mechanics (JoM) (SCI/EI)
(From 2014/Jan.~2019/Feb.) |
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Guest Editor of
IEEE Transactions on Components, Packaging and
Manufacturing Technology (SCI/EI) (From 2017/May~2019/May) |
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Lead Guest
Editor of Computer Modeling in Engineering &
Sciences (SCI/EI) for the
Special Issue of “Nano/Micro Structures in
Application of Computational Mechanics” |
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Member of
Thermal/Mechanical Simulation & Characterization
Committee in IEEE Electronic Components and
Technology Conference (ECTC) |
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IEEE International
Reliability Physics Symposium (IRPS)
Technical Committee-
Packaging and 2.5/3D Assembly (IRPS 2023, IRPS 2024) |
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The SubCommittee Member of
Packaging and Heterogeneous Integration in the 7th
IEEE Electron Devices Technology and Manufacturing
Conference (EDTM 2023). |
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Topic Organizer of
the ASME International Mechanical Engineering
Congress and Exposition (ASME IMECE 2020, ASME IMECE
2021, ASME IMECE 2022, ASME IMECE 2023, ASME IMECE
2024) |
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General Council Member of
Association of Computational Mechanics Taiwan (ACMT)
(2018.01.01~2020.12.31) |
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Technical Program
Committee Member of 22th
International Conference on Electronics Materials
and Packaging - IEEE 15th
International Microsystem, Packaging, Assembly and
Circuits Technology Conference (IMPACT-EMAP 2020
Conference) |
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Technical Program
Committee of 2016 International Electron Devices and
Materials Symposium (IEDMS 2016) |
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The Program Committee of
International Conference on Advanced Technology
Innovation 2016 (ICATI2016) |
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The Program Committee of
International Multi-Conference on Engineering and
Technology Innovation 2015-2017 (IMETI2015,
IMETI2016, IMETI2017) |
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Technical Program Committee Member of 16th International Conference on Electronics Materials and Packaging - IEEE 9th International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT-EMAP 2014 Joint Conference) |
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Technical Program Committee Member of IMAPS All Asia Conference - IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference
(IMPACT-IAAC 2013, IMPACT-IAAC 2016, IMPACT-IAAC
2019 Joint
Conferences). |
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Technical Program Committee Member of IEEE International Microsystem, Packaging, Assembly and Circuits Technology Conference (IMPACT 2011, IMPACT 2012,
IMPACT 2015, IMPACT 2017, IMPACT 2018, IMPACT 2021,
IMPACT 2022, IMPACT 2023, IMPACT 2024) |
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Local Organizing Committee of
Asian Pacific Congress on Computational Mechanics
(APCOM 2019) |
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Reviewer of Ministry of Science
and Technology (MOST) 2019 Add-on Grant for
International Cooperation research project |
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Committee member of final review
for Ministry of Science and Technology (MOST) 2022-2024
research proposals |
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Reviewer of Ministry of Science
and Technology (MOST) 2013-2024 research proposals |
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Committee member of final review
for Ministry of Science and Technology (MOST) 2017
industrial-academic cooperative project |
|
Reviewer of Ministry of Science
and Technology (MOST) 2014, 2017, 2019-2023 industrial-academic
cooperative project |
|
Reviewer and Committee member of
final review for Ministry of Science and Technology
(MOST) 2018-2019 research scholar project |
|
Committee member of final review
for Ministry of Science and Technology (MOST) 2018-2019,
2024
research proposals for undergraduates |
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Reviewer of Ministry of Science
and Technology (MOST) 2013-2019, 2021, 2024 research proposals for undergraduates |
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Chief reviewer and reviewer
member of Small Business
Innovation Research (SBIR) of Small and Medium
Enterprise Administration, Ministry of Economic
Affairs (From 2018) |
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Member of |
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ASME (American Society of Mechanical Engineers)
IET
(Institution of Engineering and Technology)
IMAPS (International Microelectronics And Packaging Society)
STAM (Society of Theoretical and Applied Mechanics of the Republic of China)
CSME (The Chinese Society of
Mechanical Engineers)
CIE (Chinese Institute of Engineers)
TACT (Taiwan Association for Coatings
and Thin Films Technology)
Chinese Society of Sound and Vibration |
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Member of the 35th-37th Journal
(Editorial) Committee for Society of Theoretical and
Applied Mechanics of the Republic of China |
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Member of the 37th
Academic Committee for Society of Theoretical and
Applied Mechanics of the Republic of China |
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Member of the 37th-39th
Finance Committee for Society of Theoretical and
Applied Mechanics of the Republic of China |
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The 38th-39th
Popular Science Committee of Chairman for Society of
Theoretical and Applied Mechanics of the Republic of
China |
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The 40th
director for Society of Theoretical and Applied
Mechanics of the Republic of China (2024-2025) |
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Director of International
Microelectronics Assembly and Packaging Society
(IMAPS)-Taiwan Chapter (From 2015) |
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Organize the 2022 and 2023
Asia-Pacific Mechanics Contest for College Students
of the Society of Theoretical and Applied Mechanics
(STAM) (2022, 2023) |
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Reviewer of |
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▪ IEEE Access
(SCI/EI)
▪ IEEE Electron Device Letters
(SCI/EI)
▪ IEEE Sensors Journal
(SCI/EI)
▪ IEEE Transactions on
Components, Packaging, and Manufacturing Technology
(SCI/EI)
▪ IEEE Transactions on Advanced Packaging
(SCI/EI)
▪ IEEE Transactions on Computer-Aided
Design of Integrated Circuits and Systems
(SCI/EI)
▪ IEEE Transactions on Components and
Packaging Technology (SCI/EI)
▪ IEEE Transactions on Electron Devices (SCI/EI)
▪ IEEE Transactions on Electronics
Packaging Manufacturing (SCI/EI)
▪ IEEE Transactions on Device and Materials
Reliability (SCI/EI)
▪ IEEE Transactions on Dielectrics and
Electrical Insulation (SCI/EI)
▪ IEEE Transactions on Flexible Electronics
▪ IEEE Transactions on Power Electronics
(SCI/EI)
▪ IEEE Transactions on Reliability
(SCI/EI)
▪ IEEE Transactions on Semiconductor
Manufacturing (SCI/EI)
▪ IEEE Journal of Microelectromechanical
Systems (SCI/EI)
▪ IEEE Journal of the Electron Devices
Society (SCI/EI)
▪ ASME Transactions Journal of Electronic
Packaging(SCI/EI)
▪ ASME Transactions Journal of Vibration
and Acoustics (SCI/EI)
▪ ACS Applied Materials & Interfaces (SCI/EI)
▪ Acta Mechanica (SCI/EI)
▪ Additive Manufacturing (SCI/EI)
▪ Advanced Electronic Materials (SCI/EI)
▪ Advanced Functional Materials (SCI/EI)
▪ AIP Advances (SCI/EI)
▪ Advances in Mechanical Engineering (SCI/EI)
▪ APL Photonics (SCI/EI)
▪ Applied Physics Letters (SCI/EI)
▪ Applied Surface Science (SCI/EI)
▪ Computer Modeling in Engineering &
Sciences (SCI/EI)
▪ Displays (SCI/EI)
▪ ECS Journal of Solid State Science and
Technology (SCI/EI)
▪ Electronics Letters (SCI/EI)
▪ Experimental Heat Transfer (SCI/EI)
▪ Experimental Techniques (SCI/EI)
▪ Flexible and Printed Electronics (SCI/EI)
▪ Heliyon (SCI/EI)
▪ Materials & Design (SCI/EI)
▪ Microelectronic Engineering (SCI/EI)
▪ Microelectronics International (SCI/EI)
▪ Microelectronics Reliability (SCI/EI)
▪ Micromachines (SCI/EI)
▪ Nanoscale (SCI/EI)
▪ Nanotechnology (SCI/EI)
▪ Physics Letters A (SCI/EI)
▪ Physica Scripta (SCI/EI)
▪ Thin Solid Films (SCI/EI)
▪ International Journal of Refractory
Metals and Hard Materials (SCI/EI)
▪ Journal of Alloys and Compounds (SCI/EI)
▪ Journal of Applied Physics (SCI/EI)
▪ Journal of Electronic Materials (SCI/EI)
▪ International Journal of Nanotechnology
(SCI/EI)
▪ Journal of Precision Engineering and
Manufacturing-Green Technology (SCI/EI)
▪ Journal of Nanoscience and Nanotechnology
(SCI/EI)
▪ Journal of Nanoelectronics and
Optoelectronics (SCI/EI)
▪ Journal of Materials Chemistry C (SCI/EI)
▪ Journal of Materials Engineering and
Performance (SCI/EI)
▪ Journal of Mechanics (SCI/EI)
▪ Journal of Mechanical Science and
Technology (SCI/EI)
▪ Journal of Micromechanics and
Microengineering (SCI/EI)
▪ Journal of Micro/Nanolithography, MEMS,
and MOEMS (SCI/EI)
▪ Journal of Plastic Film and Sheeting
(SCI/EI)
▪ Journal of the Chinese Institute of
Engineers (SCI/EI)
▪ Journal of the Mechanical Behavior of
Biomedical Materials (SCI/EI)
▪ Journal of the Society for Information
Display (SCI/EI)
▪ Journal of Vacuum Science & Technology A (SCI/EI)
▪ Polymers (SCI/EI)
▪ Polymer Engineering & Science (SCI/EI)
▪ Polymer Testing (SCI/EI)
▪ Proceedings of the Institution of
Mechanical Engineers, Part B, Journal of Engineering
Manufacture (SCI/EI)
▪ International Journal of Mechanical
Sciences (SCI/EI)
▪ International Journal of Heat and Mass
Transfer (SCI/EI)
▪ International Journal of Precision
Engineering and Manufacturing (SCI/EI)
▪ International Journal of Mechanics and
Materials in Design (SCI/EI)
▪ International Journal of Smart and Nano
Materials (SCI/EI)
▪ Mechanics of Advanced Materials and
Structures (SCI/EI)
▪ Microsystem Technologies (SCI/EI)
▪ Materials Chemistry and Physics (SCI/EI)
▪ Materials Science and Engineering A
(SCI/EI)
▪ Multidiscipline Modeling in Materials and
Structures (SCI/EI)
▪ Nanoscale Research Letters (SCI/EI)
▪ Scientific Reports (SCI/EI)
▪ Semiconductor Science and Technology (SCI/EI)
▪ Sensors & Actuators: A. Physical (SCI/EI)
▪ Small Structures (SCI/EI)
▪ Smart Materials and Structures (SCI/EI)
▪ Solar Energy Materials and Solar Cells (SCI/EI)
▪ Surface and Coatings Technology (SCI/EI)
▪ Universal Journal of Mechanical
Engineering
▪ Vacuum (SCI/EI)
▪ ASME Winter Annual Meeting Conference
(IMECE), and the ITHERM Conference
▪ The 2014 Asian Conference on Nanoscience
and Nanotechnology (AsiaNANO 2014)
▪ The 5th International
Conference on Machine Design and Manufacturing
Engineering (ICMDME2018)
▪ International Technical Conference on
Packaging and Integration of Electronic and Photonic
Microsystems Conference and Exhibition
(InterPACK2019)
▪ Proceedings of National Conference on
Mechanical Engineering (CSME29, CSME32, CSME33)
▪ 2013 Green Technology Engineering
Application Conference (2013 GTEA)
▪ CTAM 2013, the 37th National Conference
on Theoretical and Applied Mechanics (37th-NCTAM)
and the 1st International Conference on Mechanics
(1st-ICM)
▪ 2014, 2016 International Electron Devices and
Materials Symposium (IEDMS 2014, IEDMS 2016)
▪ 2015 IEEE International Magnetics
Conference (INTERMAG 2015)
▪ The Fourteenth International Federation
for the Promotion of Mechanism and Machine Science
World Congress (2015 IFToMM World Congress)
▪ 12th
International Symposium on Measurement Technology
and Intelligent Instruments (ISMTII 2015)
▪ International Multi-Conference on
Engineering and Technology Innovation 2015
(IMETI2015).
▪ CTAM 2015, CTAM 2018, CTAM 2019, CTAM
2020, National Conference
on Theoretical and Applied Mechanics. |
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Publication of over
143 peer-reviewed journal papers in SCI journals. |
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Publication of over
207 peer-reviewed conference papers worldwide. |
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Filed 14
Taiwan/US Patents and one are still in pending. |
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Over 92 Industrial/Research projects (MOST, ITRI, tsmc etc.) have been performed since 2001. |
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