The emergence of the Internet of Things (IoT) and the increasing performance demand of advanced electronic devices have revolutionized the design and manufacturing process of integrated circuits and electronic packaging. Given the increasing requirement in size (small dimension), weight (light weight), and highly heterogeneous integration, several solutions of novel and heterogeneous materials combined with microsystem devices, advanced packaging processes, and the development of state-of-the-art alignment/assembly techniques, such as through-silicon via and through-glass via, have shown a great leap in boosting device performance. However, the interactions between microstructures severely impact the reliability of components, becoming a critical issue because the reduction of the overall dimension intensifies the coupling effect of structural stress, heat dissipation, and electrical performance. Owing to the increasing urgency of addressing the mechanical and reliability issues for modern electronics, Microsystems Mechanical Design and Reliability Analysis Laboratory (MMDRAL) was founded to overcome the foregoing difficulties and establish an overall solution for further applications in advanced electronic packaging.

The fields of research in this laboratory mainly focus on the following: (1) the integration and mechanical design of 3D IC systems, (2) advanced microsystem packaging and calculational mechanics, (3) the applications of thin film mechanics in soft electronics, (4) the structural analysis and reliability estimation of high-power chip modules for vehicles, and (5) the advanced strain engineering techniques in novel FET architecture. On the basis of the fundamentals of mechanical design and analysis, the contribution of this research could be adopted as a guideline for related applications in scientific and technological developments.