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2024.04.12
Congratulation
on Prof. Lee received
“IEEE T-CPMT Best Associate Editor Award”,
2024. |
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2024.01.25
Congratulation
on our research result published at
Top 3.6% SCI journal -
IJMS (IF=7.3) 【Modeling
the Cure Shrinkage–Induced Warpage of Epoxy
Molding Compound】，International
Journal of Mechanical Sciences 268 (2024)
109056. |
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2023.11.22
Congratulation
on Prof. Lee received “Service Award” from
Society of Theoretical and Applied Mechanics
(STAM) of the Republic of China, 2023. |
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2023.11.22
Congratulation
on Yan-Hong Lin and Dei-Pei Yang received “Second
Place”
of Student Essay Contest from Society of
Theoretical and Applied Mechanics of the
Republic of China (STAM), 2023. |
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2023.11.20
Congratulation
on Prof. Lee Appointed as a
Distinguished
Researcher by the Industrial
Technology Research Institute (ITRI), 2023. |
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2023.08.23
Congratulation
on our research result published at
SCI journal - ACS Nano (IF=18.027)
【Starfish-Inspired
Diamond-Structured Calcite Single Crystal
from Bottom-Up Approach as Mechanical
Metamaterials】，ACS Nano 2023, 17,
15678−15686.
(Selected as the Front
Cover of Journal) |
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2023.08.17
Congratulation
on our research result published at
SCI journal - ACS
Applied Materials & Interfaces (IF=9.5)
【Morphological Diagram
of Dynamic-Interfacial-Release-Induced
Surface Instability】，ACS Appl. Mater.
Interfaces 2023, 15, 38975−38985.
(Selected as the Front
Cover of Journal) |
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2023.06.23
Congratulation
on our research result published at
SCI journal - NPG Asia
Materials (IF=10.761)
【Diamond-Structured
Nanonetwork Gold as Mechanical Metamaterials
from Bottom-Up Approach】，NPG Asia
Mater 15, 36 (2023). |
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2023.06.23
Congratulation
on Yu-Ru Liu received 2023 research project
of undergraduates from National Science and
Technology Council (NSTC). |
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2023.05.31
Congratulation
on Yan-Hong Lin received “Oral Presentation
Group-Honorable Mention” of Student Essay
Contest from Engineering College of National
Tsing Hua University (NTHU), 2023. |
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2023.03.01
Congratulation on Prof. Lee received
“Outstanding Research Award” from National
Science and Technology Council (NSTC), 2023. |
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2022.11.27
Congratulation
on our research result published at
SCI journal - ACS Nano (IF=18.027) 【Bioinspired
Nanonetwork Hydroxyapatite from Block
Copolymer Templated Synthesis for Mechanical
Metamaterials】，ACS Nano, Vol. 16, No.
11, pp. 18298-18306, Nov.
2022. |
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2021.11.19
Congratulation
on Chin-Yi Chen and Chi-Wei Wang received “Honorable Mention”
of Student Essay Contest from Society of
Theoretical and Applied Mechanics of the
Republic of China (STAM), 2021. |
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2021.11.16
Congratulation
on Prof. Lee received “Outstanding Youth
Award” from Taiwan Association for Coating
and Thin Film Technology (TACT), 2021. |
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2021.06.15
Congratulation
on Chia-Chi Lee received “Oral Presentation
Group-Honorable Mention” of Student Essay
Contest from Engineering College of National
Tsing Hua University (NTHU), 2021. |
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2021.06.15
Congratulation
on Ji-Yuan Syu received “Poster Display
Group-Honorable Mention” of Student Essay
Contest from Engineering College of National
Tsing Hua University (NTHU), 2021. |
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2021.05.01
Congratulation
on our research result published at
SCI journal - Nano
Letters (IF=11.238) 【Nanonetwork
Thermosets from Templated Polymerization for
Enhanced Energy Dissipation】，Nano
Letters, Vol. 21, No. 8, pp. 3355-3363, Apr.
2021. |
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2020.12.03
Congratulation on Prof. Lee serve to
Lead Guest Editor of Microelectronics
Reliability (SCI/EI) for the
Special Issue
of “Development and
Characteristics Assessment of Reliability
for Heterogeneous Integration Applications” |
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2020.12.01
Congratulation
on Ruei-Ci Shih received “Honorable Mention”
of Student Essay Contest from Society of
Theoretical and Applied Mechanics of the
Republic of China (STAM), 2020. |
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2020.12.01
Congratulation
on Yung-Hsuan Chang received “Bronze Award”
of Research Paper Award in Precision
Engineering Topics and Paper Awards of
Taiwan Society for Precision Engineering &
Chroma ATE Inc., 2020. |
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2020.11.21
Congratulation
on Yan-Cian Lin received “Honorable Mention”
of 2020 Master’s Degree Thesis Award from
Chinese Society Mechanical Engineering
(CSME). |
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2020.11.21
Congratulation
on Li-Han Peng received “Honorable Mention”
of Student Essay Contest from Proceedings of
the 37th
National Conference on Mechanical
Engineering (CSME). |
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2020.10.06
Congratulation
on
Dr. Chang-Chun Lee
received “Outstanding
Alumni” from Department of Mechanical
Engineering, Chung Yuan Christian University
(CYCU), 2020. |
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2020.05.29
Congratulation for our
paper
"Analysis of Stress Induced by Wafer
Warpage" published
in Journal of the Mechatronic Industry (Vol.
447, pp. 42-49) are
selected as the
best article in the Current Issue. |
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2019.07.30
Congratulation on Dr. Chang-Chun Lee promote to Professor |
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2019.06.05
Congratulation on Prof. Lee serve to
Associate Editor for IEEE Transactions on
Components, Packaging, and Manufacturing
Technology
(SCI/EI) |
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2018.09.13
Congratulation
on Prof. Lee
received “Outstanding Young
Investigator Award” from National Tsing Hua University (NTHU),
2018. |
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2018.08.06
Congratulation
on Jun-Fu Lu received “2017 College Student
Research Award” for the research project of undergraduates from Ministry of Science and Technology
(MOST). |
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2018.06.20
Congratulation on Prof.
Lee serve
to Associate Editor for
Microelectronic Reliability (SCI/EI) |
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2018.05.08
Congratulation
on Prof. Lee
received “Outstanding Young
Investigator Award” from Engineering College
of National Tsing Hua University (NTHU),
2018. |
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2018.02.09
Congratulation
on Prof. Lee
received
“Excellent Prize of
Industry-University Cooperation” from
College of Engineering of National Chung
Hsing University (NCHU), 2018. |
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2017.06.17
Congratulation
on Prof. Lee have been elected as a member
of Thermal/Mechanical Simulation &
Characterization Committee in IEEE
Electronic Components and Technology
Conference (ECTC) |
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2017.06.09
Congratulation
on Jun-Fu Lu received 2017 research project of undergraduates from Ministry of Science and Technology. |
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2017.05.04
Congratulation on Prof. Lee serve to
Guest Editor for IEEE Transactions on
Components, Packaging, and Manufacturing
Technology
(SCI/EI) |
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2016.11.03
Congratulation on Prof. Lee received
“Distinguished
Young Scholar Award” from
Society of Theoretical and Applied
Mechanics (STAM) of the Republic of
China, 2016. |
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2016.10.25
Congratulation on Prof. Lee
received “Outstanding Young Engineering
Professor Award” from The Chinese
Society of Mechanical Engineers (CSME),
2016. |
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2016.09.30
Congratulation for our
patent
"Method of Forming a Metal Bump" Received “Bronze Medal
Award” from Taipei International Invention
Show & Technomart, 2016. |
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2016.07.26
Congratulation on Prof. Lee received a Prize of "Project for Excellent Junior Research Investigators" from
Ministry of Science
and Technology (MOST), 2016. |
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2016.06.27
Congratulation
on Yu-Hua Dzeng and Ching-Yen Ho Received
“Masterpiece Award” from 2016 Engineering
Paper Competition of Student Chapter
(Mechanical Group) from Chinese Institute of
Engineers (CIE), 2016. |
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2015.11.18
Congratulation for our
paper
"STI Geometrical Influence of Recessed
Surface on Array-Type Arrangements of
Nano-Scaled Devices Strained by CESL and
Ge-based Stressors" received
Poster Merit Awards of TACT2015. |
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2015.10.25
Congratulation for our
journal paper
"Reliability-Based Design Guidance of
Three-Dimensional Integrated Circuits
Packaging Using Thermal Compression Bonding
and Dummy Cu/Ni/SnAg Microbumps" published
in Journal of Electronic Packaging are
selected by Intel
Corporation which is
of significant relevance to industry.
The detailed can be
linked here. |
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2015.10.23
Congratulation for our
paper
"Residual Stress Effect of
Copper-Filled Through Silicon Via on
Performances of Nano-Scaled Devices in
3D-ICs Interposer" received
IEEE IMPACT 2015 Student Paper
Award. |
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2015.10.02
Congratulation for our
patent
"The Barrier Layer Structure on
Flexible Panel" Received “Bronze Medal
Award” from Taipei International Invention
Show & Technomart, 2015. |
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2015.10.02
Congratulation
on Yu-Hua Dzeng and Ching-Yen Ho received
“Masterpiece Award” from 2015 Project
Competition of Semiconductor and
Optoelectronics Process Equipment/Critical
Part, 2015. |
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2015.09.25
Congratulation
on Prof. Lee received “Good Performance
Award for University and Industry Liaison
System” from Chung Yuan Christian University
(CYCU), 2015. |
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2015.06.05
Congratulation
on Yu-Hua Dzeng received 2015 research project of undergraduates from Ministry of Science and Technology. |
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2014.10.02
Congratulation on Prof. Lee
received “Outstanding Young Scholar Award” of
International Conference on Advanced
Manufacturing (ICAM 2014), 2014. |
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2014.09.24
Congratulation for our
paper
"Reliability Enhancement of Ultra-Thin
Chip Assembly Module in 3D-ICs Integrations
by the Assistance of Molding Compounds" received
IEEE IMPACT-EMAP 2014 Outstanding Paper
Award. |
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2014.09.09
Congratulation on Prof. Lee
received "Outstanding
Research Award" of Chung Yuan Christian University (CYCU), 2014. |
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2014.07.21
Congratulation for our
paper
"Predictions and Measurements of Interfacial
Adhesion among Encapsulated Thin Films of
Flexible Devices" received ThinFilms2014
Poster Competition Second Prize. |
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2014.07.01
Congratulation on Prof. Lee received "Young Scholar Award" of Chung Yuan Christian University (CYCU), 2014. |
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2014.06.06
Congratulation on Dr. Chang-Chun Lee promote to Associate Professor |
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2014.06.05
Congratulation on You-Sheng Lai received 2014 research project of undergraduates from Ministry of Science and Technology. |
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2014.02.01
Congratulation on Prof. Lee is promoted to IEEE Senior Member |
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2014.01.01
Congratulation on Prof. Lee serve to Associate Editor for Journal of Mechanics (JoM) (SCI/EI) |
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2013.08.08
Congratulation on Prof. Lee received "Ta-You Wu Memorial Award" from Ministry of Science and Technology, 2013. |
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2013.07.01
Congratulation on Prof. Lee received a Prize of "Project for Excellent Junior Research Investigators" from Ministry of Science and Technology, 2013. |
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2013.07.01
Congratulation on Prof. Lee received"Young Scholar Award of Chung Yuan Christian University (CYCU),"2012, 2013. |
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