| Degree |
Year |
Name |
Title |
|
M.S. |
2024 |
Meng-Tse Chen |
Analysis and Investigation
of Molding Material on High-Power Modules under
the Manufacturing Process and Thermal Cycling
Loads |
|
M.S. |
2024 |
Zi-An Huang |
Development and
Demonstration of Fatigue Life Prediction
Methodology Considering the Thermal Aging Effect
on Solder Materials |
|
M.S. |
2024 |
Dei-Pei Yang |
Optimizing the
Process-Induced Warpage Prediction Method of
Panel-Level Fan-out Packaging |
|
M.S. |
2024 |
Ming-Yuan Cheng |
Development of a Crack
Growth Simulation Methodology for Multilayer
Structures by Combining the Fracture Theories of
Interfaces and Materials |
|
M.S. |
2024 |
Hong-Yu Lin |
Warpage Estimation of
Epoxy Molding Compound under Processing
Conditions and Subsequent Moisture and Thermal
Loads |
|
Ph. D |
2024 |
Yan-Yu Liou |
Mechanical Derivation and Analyses Regarding Integrated
Process and Applied Loading |
|
M.S. |
2023 |
Wei-Cheng Tsai |
Application of Machine
Learning in Thermal Cycle Reliability Analysis
of High Power Module Packaging |
|
M.S. |
2023 |
Ting-Sheng Chang |
Using Extended Finite
Element Method to Predict the Crack Propagation
in Multilayer Structure |
|
M.S. |
2023 |
De-Yi Ye |
Simulation and
Experimental Validation of Equivalent Volume
Heat Source Method Considering Re-Melting Effect
Applied to Selective Laser Melting Process |
|
M.S. |
2023 |
Hao-Zhou Lin |
Simulation Analysis of
Warpage Induced by Cure Shrinkage Model of Epoxy
Molding Compound under Isothermal and Variable
Temperature Conditions |
|
M.S. |
2023 |
Yan-Hong Lin |
Development of Prediction
Methodology Applied to Process-Induced Warpage
of Advanced Semiconductor BEOL Interconnects |
|
Ph. D |
2023 |
Pei-Chen Huang |
Simulation-Based
Performance Analysis of Germanium
Planar/Fin-type Field Effect Transistor with
Strain Engineering and Stress Regulation
Structure Design |
|
M.S. |
2022 |
Che-Pei Chang |
Development and
Investigation on Warpage Simulation Technology
of Multi-Scale Process-Oriented Fan-Out
Panel-Level Package |
|
M.S. |
2022 |
Wen-Hsuan Chang |
Mechanical Analysis of
Circuit Layout Design on Flexible Thin Film
Under Twisting Load |
|
M.S. |
2022 |
Cheng-Han Tsai |
Experimental Verification
and Failure Analysis of Power Modules Under the
Coupling Effect of Manufacturing Process and
Power Cycling Test |
|
M.S. |
2022 |
Ping-Tsung Lin |
The Effect of Temperature
Cycling Loadings on the Microjoint
Characteristic Life Estimation of 3D ICs
Packaging Structure |
|
M.S. |
2021 |
Chia-Chi Lee |
Estimation Demonstration
and Applicability Investigation of Simulation
Methodology on Warpage Induced by Epoxy Molding
Compound Process |
|
M.S. |
2021 |
Chin-Yi Chen |
Applicability
Investigation of Equivalent Material Simulation
Approach Utilized in Warpage Estimation of
Panel-Level Fan-Out Package |
|
M.S. |
2021 |
Ji-Yuan Syu |
Simulation and
Verification of High-power Module Under the
Coupling Load Effects of Manufacturing Process
and Thermal Cycling Test |
|
M.S. |
2021 |
Yuan-Cheng Huang |
Experimental and Simulated
Verifications of Power Cycling Reliability for
the Thin and Low Warpage Power Module |
|
M.S. |
2021 |
Te-Pei Hsiang |
Performance Enhancement
Evaluation and Simulation Validation of
Germanium Gate-All-Around MOSFET with Advanced
Strained Engineering Technique |
|
M.S. |
2021 |
Allen Lee |
Warpage Estimation of
the Laminated Packaging Substrate with Cu Pillar
Structure Considering Material Characteristics |
|
Ph. D |
2021 |
Chia-Ping Hsieh |
The
Coupling Effect Investigation of Self-Heating
and Lattice Mismatch Induced Stress on FinFET
Performance |
| M.S. |
2020 |
Yan-Cian Lin |
Mechanical-Based
Analytical Derivation and Verification for the
Performance Enhancement of Strain-Induced
Advanced Semiconductor Device |
| M.S. |
2020 |
Ruei-Ci Shih |
Establishment and Verification of Interfacial
Fracture Energy Simulation Methodology for
Porous Stacked Thin Films |
| M.S. |
2020 |
Yung-Hsuan Chang |
Mechanical Model
Establishment and Numerical Analysis of Soft
Electronics with Multiple Neutral Axes |
| M.S. |
2020 |
Li-Han Peng |
Measurement and Simulation Verification of
Fracture Toughness for Additive Manufacturing
Specimens by Using Selective Laser Melting
Process |
| M.S. |
2019 |
Chi-Wei Wang |
Simulation and
Validation of Ball Drop Test for Flexible
Devices with Stress Buffer Mechanism |
| M.S. |
2019 |
Chu-Han Tsai |
Investigation of Shear Strength for the
Microbump of Advanced Packages under Temperature
Loads |
| M.S. |
2018 |
Jing-Yan He |
Investigating
Mechanical Properties of Nano-Scaled Materials
by Using Atomistic-Continuum Simulated Method |
|
M.S. |
2017 |
Hou-Chun Liu |
The
Accompanied Effects of Process-Oriented and
Temperature Cycling Loadings on the Warpage of
Thin-Type 3D-ICs Packaging Structure and the
Creep Behavior of Microjoints |
| M.S. |
2017 |
Ming-Sheng Liu |
Research for the
Fixture Type Effect of Rack Electroplating
Machineon Gold Bump Uniformity |
|
M.S. |
2016 |
Kuo-Ruei Tseng |
Flexural Load Research of Patterned Transparent
Conductive Substrate |
| M.S. |
2016 |
Chien-Hsun Chen |
Reliability Loading Impacts of 3D-ICs Package on
the Influence Investigation of Nanoscaled Device
Performance |
|
M.S. |
2016 |
Yan-Yu Liou |
Analysis and Investigation of Assembly
Reliability for IGBT Power Module |
| M.S. |
2016 |
Pei-Chen Huang |
Analysis and Investigation of Strain Engineering
Utilized in 2D/3D Nano-scaled Germanium-based
Metal Oxide Semiconductor Field Transistors
Enabled by Column IV Semiconductor Alloys |
|
M.S. |
2016 |
Hsing-Ning Liu |
Flatness Investigation of the Embedded
Interposer of 3D-ICs |
|
M.S. |
2016 |
Shun-I Keng |
Stress Analysis and Mobility Model for 3D FinFET |
|
M.S. |
2016 |
Dian-Yong Li |
The Effect of Contact-Etch-Stop-layer and Si1-xGex
Channel Mechanical Properties on Nano-Scaled
Short Channel N-MOSFETs with Dummy Gate Array |
| M.S. |
2016 |
Yen-Ting Kuo |
Interaction Influence
of S/D Lattice Mismatch and
Stress Gradient of CESL on Nano-Scaled Strained
NMOSFETs |
| M.S. |
2015 |
Yu-Huan Guo |
Mechanical Behavior Investigation of Creep and
Warpage for Thin-Type Three-Dimensional
Integrated Circuits Packaging Structures |
| M.S. |
2015 |
Bow-Tsin Chian |
Analysis and
Investigation of Material Equivalent
Mechanics-Based Simulated Approach on
Three-Dimensional Chip Stacking Structure |
| M.S. |
2015 |
Sen-Wen Cheng |
Analysis and Investigation of Strain Engineering
on Advanced Nanoscale Devices Using the Column
IV Semiconductor Alloys |
| M.S. |
2014 |
Tzai-Liang
Tzeng |
Analysis and
Investigation of Assembly Reliability for 3D-ICs
Packaging by Using Novel Thermo-Compression
Processes |
| M.S. |
2013 |
Zih-Han Chen |
The Effect of Mechanical Properties of Si1-xGex Channel and CESL Layer on Nano-Scaled nMOSFETs |
| M.S. |
2013 |
Rong Hao Deng |
Investigation of Consequent Process-Induced Stress for NMOSFET with a Sunken STI Pattern |
| M.S. |
2012 |
Chih-Sheng Wu |
Mechanical Design and Structural Sensitivity Analysis of Advanced Flexible Substrate with Multi-Thin Films |
| M.S. |
2012 |
Hsiao-Hsuan Teng |
Simulations and Experimental Validations of Nanoscale Electronic Devices Using Advanced Strained Engineering |
| M.S. |
2012 |
Min-Hui Hung |
Stress Estimation and Performance Analysis of Advanced SiGe Devices |
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